| Number |
Items |
Technical Data |
| 1 |
Max Layer Count |
32 Layer |
| 2 |
Max Board Size |
640mm*1100mm |
| 3 |
Board Thickness |
| 2 Layer |
0.2mm-6.0mm |
| 4 Layer |
0.4mm-8.0mm |
| 6 Layer |
0.8mm-8.0mm |
| 8 Layer |
1.0mm-8.0mm |
| 10 Layer |
1.2mm-8.0mm |
| 12 Layer |
1.5mm-8.0mm |
| 14 Layer |
1.5mm-8.0mm |
| 16 Layer |
1.6mm-8.0mm |
| 18 Layer |
2.2mm-8.0mm |
| 20 Layer |
2.4mm-8.0mm |
|
| 4 |
Min Trace Width |
3.0mil |
| 5 |
Min Trace Space |
3.0mil |
| 6 |
Min Hole Size |
| Through Hole |
0.15mm |
| Laser Via Hole |
0.1mm |
|
| 7 |
PTH Tolerance |
+/-0.075mm |
| 8 |
NPTH Tolerance |
+/-0.05mm |
| 9 |
Outline Tolerance |
+/-0.1mm |
| 10 |
Hole Position Tolerance |
+/-0.05mm |
| 11 |
Min Soldermask Bridge |
0.075mm |
| 12 |
Hole Wall Copper Thickness |
10um-50um |
| 13 |
Copper Thickness |
| InnerLayer |
0.5oz-5oz |
| Outer Layer |
0.5oz-13oz |
|
| 14 |
Surface Finish |
HASL, OSP, Immersion Gold/Silver/Tin, Flash Gold, Golden Finger |
| 15 |
Insulation Resistance |
1*1012Ω |
| 16 |
Aspect Ratio |
13:1 |
| 17 |
Warp And Twist |
≤0.7% |
| 18 |
Impedance Control |
+/-10% |
| 19 |
Flame Retardance |
94V-0 |
| 20 |
Material |
FR4, High TG FR4, High Frequency Material, Aluminum |
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